MECHANIC XGSP30 Classical Solder Paste 183°C [20g] – Lead-Free BGA Reballing & PCB Repair Flux Paste

MECHANIC XGSP30 Classical Solder Paste (183°C, 20g)

MECHANIC Classical Solder Paste (XGSP30) is a precision solder paste designed for mobile repair technicians and PCB rework specialists. With a melting point of 183°C, it's suited for BGA reballing, chip-level repair, SMD component soldering, and fine-pitch PCB work where smooth, reliable solder flow is essential.

Key Features

• Melting Point: 183°C — smooth, even reflow for consistent results
• Fine, Smooth Paste Texture: Easy to apply with a spatula or syringe for precise work
• Ideal for BGA & SMD Rework: Suitable for BGA reballing, chip soldering, and fine-pitch component work
• CE Certified: Meets CE compliance standards
• Anti-Counterfeit QR Verification: Scan the QR code on the lid to verify product authenticity
• Compact 20g Tin: Convenient size for workbench use and storage

Product Specifications

Who Is This For?

Suitable for mobile phone repair technicians, PCB rework specialists, and electronics hobbyists working on BGA reballing, SMD soldering, and chip-level repair tasks.

What's in the Box

• 1 x MECHANIC XGSP30 Classical Solder Paste Tin (20g)

Frequently Asked Questions

What is the melting point of this solder paste?
It has a melting point of 183°C, suitable for standard reflow and rework applications.

Is this solder paste good for BGA reballing?
Yes, MECHANIC XGSP30 is commonly used by technicians for BGA reballing and fine-pitch SMD rework.

How can I verify this product is genuine?
Scan the QR code printed on the tin lid to check product authenticity.

How should I store this solder paste?
Store in a cool, dry place and use within the shelf life printed on the tin for best results.