Amaoe MQ2 BGA Reballing Stencil for Qualcomm, MTK CPU

Qualcomm/MTK CPU MQ2 Stencil AMAOE

The Qualcomm/MTK CPU MQ2 Stencil AMAOE is ideal for mobile repair specialists looking for a versatile and durable stencil for Qualcomm and MTK CPU chip reballing. It’s designed to support a range of models, including MT6761V, MT6779V, MT6758V, MT6768V, MT6765V, SDM439, MSM8909W RAM, and MSM8909W CPU. Made from high-quality materials, this stencil ensures accurate and efficient reballing, allowing technicians to work on a wide variety of mobile devices.

Key Features:

• Versatile Compatibility: Supports multiple chip models, including Qualcomm and MTK CPU and RAM.
• Precision Reballing: Ensures accurate alignment and placement of solder balls for chip repairs.
• High-Quality Construction: Built to withstand high temperatures and frequent use.
• Professional-Grade Tool: Ideal for technicians specializing in advanced mobile repairs.

Compatible Models:

• MT6761V
• MT6779V
• MT6758V
• MT6768V
• MT6765V
• SDM439
• MSM8909W RAM
• MSM8909W CPU